Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

VANCOUVER, Wash.--(BUSINESS WIRE)--Kyocera Industrial Ceramics Corporation, Chemical Sales Division today announced the introduction of its new environmentally friendly XKE-G5633 Epoxy Molding ...

Faster, further, more efficient: Developers of e-vehicles and plug-in hybrids are aiming ever higher. The key element of these eff orts is the battery. On the one hand, it must be as ergonomic as ...

IACMI Project 3.2 evaluated carbon fiber-reinforced composites infused with a novel epoxy-based resin system to develop structural composite parts with complex geometry to replace metals in ...

Bringing mass reduction capabilities to mass production facilities, Dow Automotive can now offer 90-second cycle times for resin transfer molding (RTM) with Voraforce 5300 resin matrix, making ...