The AI-native environment is designed to streamline PCB and advanced packaging design from start to finish.

Cadence's AuraStack AI Super Agent designed for printed circuit board (PCB) and advanced packaging development.

Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents ...

The latest wave of simulation technology releases from Ansys, Cadence, and Avnet underscores a growing convergence of artificial intelligence, cloud computing, and multiphysics modeling in engineering ...

Synopsys, Inc. (NASDAQ: SNPS) today announced availability of its first Multiphysics Fusion™ solutions for customer deployment. As chip complexity increases, physics-related challenges including ...

In June 2026, Synopsys launched its AI-driven Multiphysics Fusion platform, combining its electronic design automation tools with Ansys analysis to accelerate chip timing signoff and design closure ...

The engineers and researchers highlighted in COMSOL News 2026 use COMSOL Multiphysics® to meet their development goals, push the boundaries of R&D, and bring new ideas to life. Stories in this year's ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging ...

Enables SPICE-accurate multiphysics timing analysis with up to 3x faster runtimes. Delivers up to 10x faster design closure with high ECO success rates and improved PPA ...