Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

The shift from 1D to 2D barcodes is making packaging smarter, more connected and ready for GS1 Sunrise 2027.

Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafers to 310mm x ...

It puts packaging on display with their products, in such a way that high-end brands have invested a lot in high-end ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

Patrick Nycz is President of NewPoint, a full-service food and beverage marketing agency, and author of Moving Your Brand Up the Food Chain. In the food business, where the only constant is how fast ...

Data capture platform Polytag has announced a partnership with Multi-Color Corporation (MCC) to incorporate its UV tag ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Cold Chain Technologies, a portfolio company of Aurora Capital Partners, has acquired Packaging Technology Group, a provider of sustainable, curbside-recyclable thermal packaging solutions for the ...

STEM-OPT Visa Eligible: The STEM Optional Practical Training (OPT) program allows full-time, on-campus international students on an F-1 student visa to stay and work in the U.S. for up to three years ...