Böblingen, 25. Juni 2026 – Keysight Technologies hat die Übernahme von VPIphotonics am 9. Juni 2026 abgeschlossen und damit sein Portfolio im Bereich der Photonik-Designautomatisierung um Simulationen ...
Willich-Münchheide, Germany, May 28, 2026 – ROHM has released the ROHM PLECS Simulator on ROHM’s official website. This simulation tool enables designers of power electronics circuits and system ...
Willich/Nuremberg, Germany, May 26, 2026 – ROHM will exhibit at PCIM Expo & Conference 2026, the leading international event for power electronics, intelligent motion, renewable energy and energy ...
AMP Max connectors deliver excellent high-power performance and long-term durability for demanding industrial and building automation environments GALWAY, Ireland – May 21, 2026 – TE Connectivity, a ...
Willich-Münchheide, 21. Mai 2026 – ROHM hat mit der RESDxVx-Serie neue ESD-Schutzdioden entwickelt, die sowohl einen branchenweit führenden niedrigen dynamischen Widerstand (Rdyn) als auch eine extrem ...
Willich-Münchheide, Germany, May 21, 2026 – ROHM has developed new Electro-Static Discharge (ESD) protection diodes – the RESDxVx series – that achieve both industry-leading low dynamic resistance ...
Major new version of VDA delivers a fully flexible multi-window workspace, native CAN/LIN bus trace data viewing, live Dashboard gauges and optional future VISION Enterprise collaboration. Novi, ...
Saarbruecken/Germany, 11 March 2025 – HighTec EDV-Systeme GmbH announces the release of its new LLVM-based, automotive-grade RISC-V compiler designed to support the Infineon automotive RISC-V virtual ...
Razorcat Development has appointed Logic Technology B.V. as the newest member of its international distributor network. Effective immediately, Logic Technology will support customers across Belgium, ...
» Vector » Press Releases » Press Release Date: 01.04.2025 10:00 Number: VN5614 » Press Photos The VN5614 Automotive Ethernet 10BASE-T1S Interface with USB-C (Image rights: Vector Informatik GmbH) » ...
Willich-Münchheide, Germany, June 09, 2026 – ROHM has developed the TSC3PAK (14.00 × 18.58 × 3.50mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat ...
Böblingen, 7. April 2026 – Keysight Technologies stellt neue Lösungen für Konformitätstests von Automotive-Ethernet-Empfängern vor, die für die Validierung von 10BASE-T1S bis 10GBASE-T1 ausgelegt sind ...
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