The facility in Sanand is the third semiconductor packaging plant to begin commercial production in India this year ...

CG Power begins shipping chips from its Sanand facility, a major step in India's semiconductor goals. The venture, with ...

Modi opens CG Semi's $870m Sanand OSAT plant, packaging 200 million chips a year at launch as India's semiconductor mission gathers pace.

On July 2, Senate Minority Leader Chuck Schumer joined University President Anne D'Alleva to announce Bing. U's new ...

U.S. Senator Chuck Schumer is highlighting a major investment in advanced manufacturing and workforce development at ...

U.S. Senator Chuck Schumer returned to one of his favorite places today, visiting Binghamton University to celebrate another ...

Japanese Prime Minister Takaichi Sanae shakes hands with Indian Prime Minister Narendra Modi at their first meeting, on the sidelines of the G-20 summit in Johannesburg, South Africa, Nov. 23, 2025.

Companies building the largest AI accelerators face a growing cost problem that has nothing to do with transistors. The expense of packaging those chips, connecting multiple silicon dies on a single ...

Microelectronics are fundamental to nearly every modern device, from household appliances and computers to the vehicles we drive every day. A standard passenger car has more than 1,000 processors ...

Abstract: Sintering of nano silver particles has been proven to be an effective technique for achieving the high-performance reliable interconnects required for microelectronics packaging of wide ...

Jet dispensing has emerged as a pivotal non-contact technique for depositing minute volumes of adhesives, solder pastes and encapsulants in the assembly of microelectronic devices. By propelling fluid ...