Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

Amid rising domestic demand for semiconductors fueled by the rapid expansion of AI, China’s ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafers to 310mm x ...

It puts packaging on display with their products, in such a way that high-end brands have invested a lot in high-end ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Data capture platform Polytag has announced a partnership with Multi-Color Corporation (MCC) to incorporate its UV tag ...

Digital packaging bridges the gap between limited physical space and the growing demand for transparency, playing a crucial role in delivering sustainability insights that benefit brands and consumers ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Cold Chain Technologies, a portfolio company of Aurora Capital Partners, has acquired Packaging Technology Group, a provider of sustainable, curbside-recyclable thermal packaging solutions for the ...

STEM-OPT Visa Eligible: The STEM Optional Practical Training (OPT) program allows full-time, on-campus international students on an F-1 student visa to stay and work in the U.S. for up to three years ...