Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Lux Semiconductors' System-on-Foil technology is designed to reduce the size and improve the performance of microelectronics for spacecraft, aircraft and other applications. Credit: Lux Semiconductors ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

In pursuit of more powerful microelectronic systems, more powerful microchips must be packaged closer together, with more robust connections – the same is true for the research partnership to achieve ...

ANDOVER, Mass., April 21, 2022 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, hosted a ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International ...

The U.S. Department of Defense (DoD) celebrated a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program with the delivery of the first SHIP prototype ...

A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations” was ...

Advances in semiconductors, materials, power, and more are enabling electronics to miniaturize—including medical electronics. Design News asked Dave Fromm, Promex’s new chief operating officer, a few ...