Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

Amid rising domestic demand for semiconductors fueled by the rapid expansion of AI, China’s ...

Taiwan Semiconductor Manufacturing (NYSE:TSM) is accelerating development of a next-generation AI chip packaging technology called CoPoS that shifts production from round 12-inch wafers to 310mm x ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

While much has been said about advanced packaging in the context of Malaysia's semiconductor sector, little is actually known ...

It puts packaging on display with their products, in such a way that high-end brands have invested a lot in high-end ...

Plastipak Packaging Inc., headquartered in Plymouth, Michigan, has announced its Direct Object Printing (DOP) patented technology has earned a 2017 Silver Award for Packaging Innovation from DuPont ...

Data capture platform Polytag has announced a partnership with Multi-Color Corporation (MCC) to incorporate its UV tag ...

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips ...

Flexible packaging manufacturers must address substrate challenges, printing technology upgrades, and quality control systems ...

The Packaging Science and the Graphic Media Science and Technology (GMST) departments at Rochester Institute of Technology will merge, as part of the continuing strategic growth of RIT’s College of ...

STEM-OPT Visa Eligible: The STEM Optional Practical Training (OPT) program allows full-time, on-campus international students on an F-1 student visa to stay and work in the U.S. for up to three years ...