COM Express Mini boards add Apollo Lake processors in credit card format Congatec has developed a family of low-power modules for the industrial and extended temperature range in the credit card sized ...
Abstract: Fatigue-induced delamination of the direct-bonded copper solder layer is a critical and latent failure mode in multichip insulated gate bipolar transistor (IGBT) power modules. To address ...
Abstract: To leverage the outstanding high-temperature resistance of silicon carbide (SiC), theoretically up to 500 °C, conventional packaging materials, and structures have become inadequate to meet ...
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