Samsung Electronics introduced a standalone turnkey security solution comprised of a Secure Element (SE) chip (S3FV9RR) and enhanced security software that offers protection for tasks such as booting, ...
Accuron Technologies secures a controlling interest in Trymax Semiconductor Equipment (Trymax), a specialist in plasma-based and UV-based process equipment and solutions for semiconductor ...
HSINCHU, Taiwan –MediaTek announced a new addition to its ASIC lineup with a 56G SerDes IP chip available with silicon-proven 7nm FinFET process technology. MediaTek’s 56G SerDes is a high-performance ...
DFB laser dies bonded onto a 300mm silicon photonics wafer. imec together with Sivers Photonics (formerly CST Global, and a subsidiary of Sivers Semiconductors), and ASM AMICRA Microtechnologies ...
Holtek announced the release of its new wireless charger transmitter Flash MCU, the HT66FW2350. The device includes a host of wireless charger transmitter required functions such as AM demodulation ...
HSINCHU, Taiwan - eMemory and United Microelectronics Corporation today announced that eMemory’s Resistive Random Access Memory (RRAM) IP has been qualified on UMC’s 22nm ultra-low power process, ...
esmo group (esmo) announced the launch of ares auto setup, the world’s first final test manipulator capable of automated test head finding and positioning. esmo group (esmo) announced the launch of ...
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HSINCHU, Taiwan - Cadence Design Systems and United Microelectronics Corporation announced that the Cadence millimeter w... Cadence Teams with TSMC, Microsoft to Reduce ICs Design Timing Signoff ...
Keysight Technologies announced the collaboration with Bluetest on the successful creation of a narrowband - internet of things (NB-IoT)) over-the-air (OTA) solution ...
Samsung Electronics announced that it has begun mass producing the highest-capacity mobile DRAM – the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) package – optimized for ...
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