台積電將於16日舉行法說會，市場聚焦先進封裝技術演進。隨著AI晶片需求激增，傳統晶圓級封裝面臨瓶頸，面板級封裝（PLP）與方形玻璃基板技術躍升為產業新焦點。法人指出，改採方形基板可大幅提升面積利用率至95%，並降低生產成本逾60%，成為AI與HPC晶 ...
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