The High-Bandwidth Memory (HBM) semiconductor market is set for a substantial growth, with latest Yole Group forecasting revenues to reach US$14 billion by 2024 and an impressive CAGR of approximately ...

The Indian PC market (including desktops, notebooks and tablets) grew 4% year on year in Q4 2023, with 4.3 million units shipped. This growth was primarily driven by a 27% increase in desktop ...

Orbit & Skyline is holding the Bengaluru Job Fair ’26 on 11 April 2026 at Hyatt Centric MG Road Bangalore from 9:00 AM to 6:00 PM IST. The event targets professionals with backgrounds in OSAT, EMS, ...

[00:00:00] Art Amor: Welcome back to EE Herald's Silicon Bridge. I'm Art, managing editor here in the US, and with me as always are Reddi, our editor, and US editor, Ashish. Guys, the energy in New ...

Global smart card shipments reached 8.32 billion units in 2025 and are projected to increase to 8.46 billion by 2030, according to ABI Research. The modest growth reflects the effects of inventory ...

Qualcomm Technologies announced the Snapdragon Reality Elite Platform at Augmented World Expo. The platform is designed for immersive spatial computing experiences with on-device AI and is intended ...

PicoJool has announced the introduction of 200G Vertical Cavity Surface Emitting Lasers (VCSELs) and MicroVCSELs targeted at scale-up applications in AI data centers. The products feature bandwidth ...

Skyworks and Qorvo have entered into a definitive agreement to combine in a cash-and-stock transaction valuing the enterprise at approximately $22 billion, creating a U.S.-based company focused on ...

Littelfuse, announced the TX00AS314TRA Omnipolar TMR Switch Sensor, a magnetic sensing device that combines a TMR sensing element with integrated CMOS signal-processing circuitry, including an on-chip ...

Cadence and Intel Foundry have announced a multi-year expanded collaboration centered on Design Technology Co-Optimization (DTCO) for Intel's next-generation 14A process node one of the most advanced ...

JEDEC Solid State Technology Association announced the publication of two new documents developed by its JC-70.2 Silicon Carbide Subcommittee: JEP203 and JEP204. JEP203: Guideline for Short Circuit ...

Siemens announced new 3D electrical design capabilities within its Capital software. The update unifies wiring design and physical harness routing in a single, model-based workflow that spans the ...