Micron has started construction on a ¥1.5 trillion ($9.3 billion) expansion at its semiconductor factory in Higashihiroshima City, Hiroshima Prefecture, Japan, to increase production of high-bandwidth ...
The High-Bandwidth Memory (HBM) semiconductor market is set for a substantial growth, with latest Yole Group forecasting revenues to reach US$14 billion by 2024 and an impressive CAGR of approximately ...
The Indian PC market (including desktops, notebooks and tablets) grew 4% year on year in Q4 2023, with 4.3 million units shipped. This growth was primarily driven by a 27% increase in desktop ...
Orbit & Skyline is holding the Bengaluru Job Fair ’26 on 11 April 2026 at Hyatt Centric MG Road Bangalore from 9:00 AM to 6:00 PM IST. The event targets professionals with backgrounds in OSAT, EMS, ...
Yole Group released its report, Humanoid Robots 2025, providing analysis of the global humanoid robot industry from 2025 to 2035, including market forecasts, technology evolution, and strategic ...
In an interactive talk hosted by Srinivasa Reddy N, Editor of EEHerald, executives from GeniSys GmbH shared insights into the company’s software solutions for advanced semiconductor manufacturing and ...
[00:00:00] Art Amor: Welcome back to EE Herald's Silicon Bridge. I'm Art, managing editor here in the US, and with me as always are Reddi, our editor, and US editor, Ashish. Guys, the energy in New ...
Intel Appoints Seok-Hee Lee as Executive Vice President of Intel Foundry to Oversee Advanced Packagi
Intel Corporation announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, ...
Hi, welcome to our interactive talk with two executives from genisys who are very much into (0:22) advanced semiconductor manufacturing, more than hardware, they are into software. Host: (0:26) Me, ...
COSEIn is organized by the Centre for Nano Science and Engineering (CeNSE),IISc to serve as a premier platform uniting key stakeholders in India’s semiconductor ecosystem Over the past few years, ...
CADFEM APAC and SilTerra Malaysia Sdn. Bhd. have signed a Memorandum of Understanding (MoU) to establish a framework for advancing semiconductor technologies through simulation-led engineering and ...
AMD and Rackspace Technology have signed a definitive agreement for the phased deployment of an initial 30 MW footprint of AMD-based compute across Rackspace’s global data centers. The deployment is ...
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