Intel revising 1.4nm-class manufacturing technology roadmap by evaluating a new hybrid power delivery architecture.

Anglia Components has entered into a distribution agreement with semiconductor manufacturer 3PEAK, expanding its analogue and ...

Pickering Interfaces unveils new PXI/PXIe analogue output modules, broadening its portfolio of simulation solutions.

Inelco Hunter's new Connector Clinic supports engineers with interconnect challenges - from development to deployment.

The launch builds on the company's HSAutoLink portfolio, which Molex says has delivered more than 700 million connectors to ...

AMD has introduced its Versal Premium Gen 2 Memory on Package (MoP) adaptive system-on-chip (SoC) family, integrating ...

SYSGO releases ELinOS 8, its industrial Linux platform, introducing new cybersecurity and compliance capabilities.

According to reports, Anthropic is considering Samsung as a potential manufacturing partner for the project, which remains in ...

Xiphera has been chosen to participate in a new project under the European Space Agency’s (ESA) ARTES programme, focusing on ...

Hardware Pioneers MAX 2026 marked a significant milestone for the UK's electronics and embedded systems sector.

Why thin film patterned substrates are often the foundation for critical electronics in aerospace and defence systems.

Onomondo and Kigen have partnered to provide an interoperable SGP.32 eSIM ecosystem for Internet of Things (IoT) deployments, ...